1. Curing agent for powder coatings

Polyester TGIC powder coating is a commercially available polyester powder coating. In this powder coating, low molecular weight Glycidol or epoxy functional group curing agent is added to react with hydroxyl group in polyester. In this way, polyester accounts for a high proportion in powder coatings, thus polyester TGIC powder coatings have excellent weather resistance and corrosion resistance. However, the solvent and chemical resistance of polyester TGIC powder coatings are not ideal. The reaction between polyester resin and TGIC is shown in the figure: the stable structure of TGIC and the three functional groups of TGIC can form a stable three-dimensional structure of the coating film, which has good flexibility and weather resistance. Polyester TGIC powder coating has good adhesion, corrosion resistance, and outdoor durability. The curing temperature is lower than that of polyurethane polyester powder coating, and the curing cycle is also shorter than that of polyurethane polyester powder coating. In addition, the polyester TGIC powder coating is thick and tough, and has good edge coverage. Therefore, it can be applied in situations where sharp edges or corners exist, such as car hubs, air conditioners, lawn furniture, and cabinet air conditioners.

2. UV curing coating

Three functional group epoxy propyl isocyanurate acrylate (TGICA) was obtained by addition esterification of acrylic acid using tri (epoxy propyl) isocyanurate as the resin matrix. The effects of catalyst type, raw material ratio, polymerization inhibitor type, esterification temperature, and reaction time on product performance were studied.

The results showed that the optimum conditions for the synthesis of TGICA were: n (TGIC): n (AA): 1:2179, the catalyst was Ⅳ, Ⅳ - dimethylaniline, the polymerization inhibitor was 2,6-di-tert-butyl-neneneba p-cresol, the reaction temperature was (105 ± 2) ℃, and the reaction time was 3 h. The conversion rate of acrylic acid can reach 99.17%. Application studies have shown that TGICA is a UV curable coating film-forming resin with excellent performance, low cost, and simple synthesis method.

By using different monomers and photosensitizers, UV coatings with different uses were obtained. After UV curing, excellent performance coatings were obtained. Can be used for UV coating on gravure printing paper, metal cover UV coating, etc. The coating has the advantages of fast curing response, good anti fouling performance, and hard coating.

3. Flame retardant epoxy resin

A new nitrogen-containing flame retardant epoxy resin was synthesized from phenol, xylene formaldehyde resin (XF) and TGIC by two steps. The reaction process and conversion rate were monitored using GPC, and the structure of the resin was characterized by IR and H NMR. Through the study of the two-step reaction, the synthesis process of phenol modified xylene formaldehyde resin (PXF) was determined. Introducing TGIC into the PXF molecular chain is expected to produce a new type of nitrogen containing flame-retardant epoxy resin with good resistance, electrical and mechanical properties, and green environmental protection.

Due to its high nitrogen content (14%), TGIC has certain self extinguishing and arc resistance. TGIC is mainly used as molding materials for electrical laminates, insulation coatings for electronic and electrical devices, semiconductor packaging materials, etc. Flame retardant plastics and composite materials are also one of the main varieties of flame retardant copper clad laminates. By combining TGIC with acrylic resin, a water-soluble pressure sensitive adhesive can be produced. This adhesive can be used on non-woven fabrics, plastic tapes, and paper tapes, greatly improving its adhesion, water resistance, and heat resistance.

Solder resistant ink is one of the commonly used chemicals in printed circuit boards (PCBs). Except for solder joints, other parts of the PCB surface need to be covered with a layer of solder resistant ink as a protective coating to selectively shield the wire pattern from damage, prevent short circuits caused by solder bonding, increase insulation, and prevent circuit corrosion and disconnection; At the same time, solder resist ink has excellent electrical properties, heat resistance, chemical resistance, moisture resistance, salt spray resistance, and physical and mechanical properties to ensure the safety and electrical performance invariance of PCBs in production, transportation, storage, and use, and to have an aesthetic effect on PCBs.

4. Application of optical performance

Motorola uses TGIC, alkaline zinc based borosilicate glass and other compositions to apply to semiconductor devices. Its main molding material is TGIC, with a refractive index of 1.52. Alkaline zinc based borosilicate glass with similar refractive index was selected as the filler, and anhydride was used as the curing agent. On this device, 50% of the 400-900 nm optical signal is allowed to pass directly through the packaging material, with a refractive index of 1.50 to 1.58, and the optical signal can be converted into a digital signal. This device can be used as Optical isolator, optical connector, optical display, etc. It can work at -40~130 ℃.